Overview
- Comprehensive presentation of the manufacturing processes used in the production of microelectronic circuits
- Manufacturing processes and technologies in microelectronics
- Current methods of microelectronic integration technology
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Table of contents (13 chapters)
Keywords
About this book
The book presents the basic steps and the technical implementation of individual processes for microelectronic circuit integration in silicon. Interaction and influences of e. g. oxidation, etching, doping and thermal processes for integrating CMOS- and Bipolar circuits are discussed in detail, beginning with the purification of silicon up to the encapsulated integrated circuit. It includes modern processes like atomic layer deposition and etching for nanoscale structures and compares improvements like silicide contacts, copper metallization, high-k dielectrics, and SOI and FINFET structures. All processes are presented looking from the process engineer’s view.
Authors and Affiliations
About the author
About the Author
Prof. Dr.-Ing. Ulrich Hilleringmann has been teaching semiconductor technology, microelectromechanical systems, sensor technology and optoelectronic system integration since 1989.Bibliographic Information
Book Title: Silicon Semiconductor Technology
Book Subtitle: Processing and Integration of Microelectronic Devices
Authors: Ulrich Hilleringmann
DOI: https://doi.org/10.1007/978-3-658-41041-4
Publisher: Springer Vieweg Wiesbaden
eBook Packages: Engineering, Engineering (R0)
Copyright Information: The Editor(s) (if applicable) and The Author(s), under exclusive license to Springer Fachmedien Wiesbaden GmbH, part of Springer Nature 2023
Softcover ISBN: 978-3-658-41040-7Published: 03 August 2023
eBook ISBN: 978-3-658-41041-4Published: 02 August 2023
Edition Number: 1
Number of Pages: XI, 264
Number of Illustrations: 176 b/w illustrations, 2 illustrations in colour
Topics: Electronics and Microelectronics, Instrumentation, Circuits and Systems, Electronic Circuits and Devices, Semiconductors